Rack and Tower Servers
Embracing the future with innovation and pushing the edge of computing
With excellent technology, KAYTUS enhances the environmental awareness features of the server system, sets new power supply standards, develops automated O&M management tools, and optimizes designs, components, and systems to create more intelligent and user-friendly servers.
Critical components of KAYTUS servers are lead-free and compliant with ROHS requirements. All packaging materials are recyclable and environmentally friendly. In addition, KAYTUS provides comprehensive liquid-cooling solutions for data centers. With full-stack liquid-cooling capabilities, KAYTUS servers achieve a data center PUE below 1.1.
The multifaceted intelligent design of servers, system management, and O&M significantly contributes to refined and intelligent customer O&M. Cloud-based O&M, combined with online diagnosis accuracy of up to 95%, greatly reduces data center complexity.
Originating from open sources but surpassing them, KAYTUS servers integrate various open software protocols and hardware designs from the industry. KAYTUS is dedicated to constructing an open computing ecosystem and continuously enhancing the impact of this ecosystem by developing products that adhere to standards and lead projects.
| Main Application Scenarios | Model | Height | Processor | Accelerator Card | DIMM | Storage | Cooling Mode | Details |
| Container cloud/Big Data applications | KR2190V3-Intel | 2U | 1 or 2 Intel® Xeon® 6 processors (SRF-AP/GNR-AP) | 4*DW；8*SW | 24 DDR5 DIMMs | 12-drive configuration: | Air cooling | More |
| Container cloud/Big Data applications | KR2190V3-AMD | 2U | 1x AMD EPYC™ 9005 series processor | 4*DW；8*SW | 12 DDR5 DIMMs | 12-drive configuration: | Air cooling | More |
| Bare Metal/Cloud Computing/ERP | KR1180V3 | 1U | 1 Intel® Xeon® 6 processors | 1*SW | 8 DDR5 DIMMs | 10-drive configuration: | Air cooling/Cold plate cooling | More |
| Big data/Cloud computing/Distributed all-flash storage/Video transcoding/Virtualization | KR1180V3 | 1U | 1x AMD EPYC™ 9005 series processor | 1*SW | 24 DDR5 DIMMs | Storage Front: | Air Cooling | More |
| Big data/Distributed storage/High-performance computing/Video transcoding | KR2180V3 | 2U | 1x AMD EPYC™ 9005 series processor | 4*DW | 24 DDR5 DIMMs | Front: | Air Cooling | More |
| Cloud storage pools/Dig data storage/Warm/Cold data storage | KR4266V3 | 4U | 1 or 2 Intel® Xeon® 6 processors | 4*DW；8*SW | 32 DDR5 DIMMs | Front: | Air cooling/Cold plate cooling | More |
| Critical application/High-performance computing/SAP HANA | KR4480V3 | 4U | 2x or 4x Intel® Xeon® 6 processors | 4*DW；8*SW | 64 DDR5 DIMMs | Front: | Air Cooling | More |
| Access Application/Big Data/Cloud Computing/High-performance computing | KR1280V3-Intel | 1U | 1 or 2 Intel® Xeon® 6 processors | 3*SW | 32 DDR5 DIMMs | Front: | Air cooling/Cold plate cooling/Immersion cooling | More |
| High-performance computing/Virtualization | KR1280V3-AMD | 1U | 1 or 2 AMD EPYC™ 9005 series processors | 2*SW | 24 DDR5 DIMMs | Front: | Air cooling/Cold plate cooling | More |
| Full-scenario Adaptable | KR2280V3-Intel | 2U | 1 or 2 Intel® Xeon® 6 processors | 4*DW；8*SW | SP Platform: 32x DDR5 DIMMs AP Platform: 24x DDR5 DIMMs | Front: | Air cooling/Cold plate cooling | More |
| Cloud computing, Enterprise market, High-performance computing | KR2280V3-AMD | 2U | 1 or 2 AMD EPYC™ 9005 series processors | 4*DW；8*SW | 24 DDR5 DIMMs | Front: | Air cooling/Cold plate cooling | More |
| Big data/High-performance computing/High-density computing | K24V3-Intel | 2U | 2 Intel® Xeon® 6 processors per node | NA | 24 DDR5 DIMMs per node | Configuration: | Air cooling/Cold plate cooling | More |
| Big data/High-performance computing/High-density computing | K24V3-AMD | 2U | 2 AMD EPYC™ 9005 series processors per node | NA | 24 DDR5 DIMMs per node | Configuration:1: 2× 2.5-inch SATA/NVMe SSDs (7mm) per node2: 1× 2.5-inch SATA/NVMe SSDs (15mm) per node | Air cooling/Cold plate cooling | More |
| Big data/High-performance computing/High-density computing | K22V3-AMD | 2U | 1 AMD EPYC™ 9005 series processors per node | NA | 12 DDR5 DIMMs per node | 6× SATA/NVMe SSDs per node 2× internal SATA/PCIe M.2 SSDs per node | Air cooling/Cold plate cooling | More |
| Email Print services Remote office environments | KT3020V2 | / | One Intel® Xeon® Scalable E-series Tatlow platform processor or Intel® Pentium® processor | 1*DW 1*SW | 4 DDR4 | 4 × 3.5-inch SAS/SATA HDD 4 × 2.5-inch SAS/SATA HDD 4 × 2.5-inch SATA SSD 1 × SATA/PCIe M.2 SSD | Air cooling | More |
| Cloud computing Virtualization | KR1270V2 | 1U | One or two 4th/5th Gen Intel® Xeon® Scalable processors | 3*SW | 16 DDR5 | Front: 10 × 2.5-inch SAS/SATA/NVMe drive 4 × 3.5-inch SAS/SATA/NVMe drive + 2 × M.2 SSD + 2 × E1.S SSD Internal: 2 TF cards2 PCIe x4 M.2 SSDs | Air cooling | More |
| Access Application Big Data/Cloud Computing High-performance computing | KR1280V2 | 1U | Two 4th Gen Intel® Xeon® Scalable processors | 3*SW | 32 DDR5 | General | Air cooling Cold plate cooling Immersion cooling | More |
| High-performance computing Virtualization | One or two 4th Generation AMD EPYCTM processors | 2*SW | 24 DDR5 | Front: 4x 3.5-inch + 4x 2.5-inch SATA/SAS/NVMe drives 4x 3.5-inch SATA/SAS/NVMe drives +2x E1.S + 2x M.2 SSDs 10/12x 2.5-inch SATA/SAS/NVMe drives Internal: 2x SATA M.2 SSDs2x PCIe M.2 SSDs | Air cooling Cold plate cooling | |||
| Big data Cloud computing Distributed storage all-flash storage Video transcoding Virtualization | KR1180V2 | 1U | One AMD EPYCTM 9004 series processor | 1*SW | 24 DDR5 | Front: | Air cooling | More |
| Big data Distributed storage High-performance computing Video transcoding | KR2180V2 | 2U | One AMD EPYCTM 9004 series processor | 4*DW | 24 DDR5 | Front: | Air cooling | More |
| Big data CDN/Distributed storage Hyper-convergence | KR2266V2 | 2U | One or two 4th Gen Intel® Xeon® Scalable processors | 2*SW | 32 DDR5 | Front: | Air cooling | More |
| Critical application High-performance computing SAP HANA | KR2460V2 | 2U | Two or four 4th Gen Intel® Xeon® Scalable processors | 2*DW 4*SW | 64 DDR5 | Front: 24 × 2.5-inch SAS/SATA/NVMe drives, 24 × E3.S NVMe SSD, 25 × 2.5-inch SAS/SATA drives 21 × 2.5-inch SAS/SATA drives + 4 × 2.5-inch SAS/SATA/NVMe drives 8 directly-connected SATA drives onboard | Air cooling | More |
| Full-scenario Adaptable | KR2280V2 | 2U | One or two 4th/5th Gen Intel® Xeon® Scalable processors | 4*DW 8*SW | 32 DDR5 | General | Air cooling Cold plate cooling | More |
| Cloud computing, Enterprise market, High-performance computing | One or two 4th Generation AMD EPYC™ processors | 24 DDR5 | Front | |||||
| Archiving Big data Cloud storage Video storage | KR4276V2 | 4U | One or two 4th Gen Intel® Xeon® Scalable processors | NA | 32 DDR5 | Rear I/O： | Air cooling | More |
| Cloud storage pools Dig data storage Warm/Cold data storage | KR4266V2 | 4U | One or two 4th Gen Intel® Xeon® Scalable processors | 2*DW 8*SW | 32 DDR5 | Front: | Air cooling Cold plate cooling | More |
| Critical application High-performance computing SAP HANA | KR4480V2 | 4U | Four 4th Gen Intel® Xeon® Scalable processors | 4*DW 8*SW | 64 DDR5 | Front: | Air cooling | More |
| Databases/ERP High-performance computing SAP HANA Virtualization | KR6880V2 | 6U | Four or eight 4th Gen Intel® Xeon® Scalable processors | 4*DW 8*SW | 128 DDR5 | Front: 24 × 2.5-inch SAS/SATA/NVMe drives Internal: 2 SATA/NVME M.2 SSDs 3 TF cards | Air cooling | More |
*Not available in the United States
