K24V2 is latest 2U 4-node server which is optimized for data center and high-performance computing. K24V2 is powered by 8 5th/4th Gen Intel® Xeon® Scalable Processors with liquid cooling solution covering CPU, memory and VR module, meet low PUE requirements. K24V2 is optimized in terms of heat dissipation, power supply, monitoring and management to meet the requirements of HPC customers for the ultimate performance experience and new generation of high-density energy-saving data centers.
Integrated and simplified delivery of the whole cabinet
Exclusive air-liquid CDU solution, quickly deploying liquid-cooled system without data center modification
Supporting Liquid-liquid CDU, one-site agile deployment of datacenter
3D dynamic management for cabinet environment monitoring temperature, humidity and leakage information in real time, achieving intelligent maintenance
Reliable full cold-plate liquid cooling design for CPU+DIMM+VR, meet low PUE requirements
Less cooling devices deployment in data center, significantly optimizing datacenter TCO
Industry-leading CPU computing power, Powered by 8 5th/4th Gen Intel® Xeon® Scalable Processors in 2U space
Up to 4TB DDR5 Memory and NDR InfiniBand, suppressing latency and breaking the obstacles of memory bandwidth
Model | K24-X2-A0-R0-00 (Air cooling) /K24-X2-A0-R0-00 (Liquid cooling) |
Specifications | 4 independent hot-swappable nodes in 2U Chassis |
Storage | Config 1: 8*2.5 inches SATA/NVMe SSD (7mm) Config 2: 4*2.5 inches SAS/NVMe SSD (15mm) |
PSU | 4*2200W Platinum/Titanium PSUs, support N+N redundancy |
Cooling | Air cooling: Four or five 8086 fans in the front of the chassis, N+1 redundancy Liquid cooling: 2x8080 fans in the front of the chassis, N+1 redundancy, node liquid cooling |
Chassis | 447mm(W)*87mm(H)*896mm(D), without chassis lugs 447mm(W)*87mm(H)*921mm(D), with lugs |
Operating temperature | Air cooling: 5℃~40℃ Liquid cooling: 5℃~45℃ |
Weight | net weight：＜51kg (fully equipped); gross weight：＜75kg (host+package+rail+accessory+pallet) Air cooling and liquid cooling are different, refer to the technical white paper for details |
Node | KM1270-X2-A0-R0-00 (Air cooling) /KM1270-X2-C0-R0-00 (Liquid cooling) |
Specifications | 1U half-width 2-socket compute node |
CPU | 2*5th/4th Gen Intel® Xeon® Scalable Processors per node, TDP 350W, 4 UPI links |
Chipset | Intel® C740 |
Memory | 16 DDR5 5600MHz RDIMM per node |
PCIe expansion | Air cooling: 1 PCIe 5.0 x16+1 PCIe 4.0 x16 slots per node Liquid cooling: 1 PCIe 5.0 x16 slot per node |
IO | Front: 2*USB2.0，1*VGA, 1*PWR button, 1*UID Rear: 1*RJ45, 1*UID, 1*RST button, 1*micro USB for debug, 1*micro USB |
Storage | Config 1: 2*2.5 inches SATA/NVMe SSD(7mm) per node Config 2: 1*2.5 inches SAS/NVMe SSD(15mm) per node 2*SATA/PCIe M.2 per node |
Raid | Support Raid controller cards with Raid levels 0/1,and support VROC |
BMC | Aspeed AST2600 |
TPM | TPM2.0 |
NIC | 1*OCP 3.0 card per node, can also support PCIe network card |
OS | Windows Server2019/2022，Red Hat Enterprise Linux8.6/9，Debian9.x，CentOS8.5，VMware ESXi7.0/8.0，Ubuntu22.4 |
K24V2 White Paper
K24V2 Datasheet
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