Home Rack and Tower Servers KR1180V3 KR1180-X3-A0-R0-00
KR1180V3
KR1180V3

KR1180V3

Key Features
  • Efficient expansion, robust cooling
    Efficient expansion, robust cooling

    Supporting up to 6 I/O extensions for flexible satisfaction of high I/O expansion scenarios, including all-flash and GPU resource pools.

    Featuring superior cooling design, accommodating CPUs with the highest TDP within a 1U space.

  • Ultimate design, agile architecture
    Ultimate design, agile architecture

    Modular design in a flexible layout, significantly optimizing chassis depth for various application scenarios.

    Separated boards for independent development, flexible matching, and replacement, enhancing architecture flexibility and ensuring maintenance ease for customers.

    System compatibility with a range of rich and non-rich I/O SKUs, eliminating the need to replace the motherboard.

  • Optimized latency, rapid response
    Optimized latency, rapid response

    The single-socket architecture eliminating mutual socket access, UPI interconnection, and cross-NUMA access, resulting in reduced latency, which enhancing user experience, increasing system efficiency, improving interactivity, decreasing package loss rate, and supporting a higher number of concurrent users.

Technical Specifications


Model

Maintenance

Cooling

KR1180-X3-A0-R0-00

Rear I/O

Air cooling

KR1180-X3-C0-R0-00

Rear I/O

Cold-plated liquid cooling

Processor

1 Intel® Xeon® 6 processor (SRF-AP/GNR-AP), up to 350W TDP 

Memory

Up to 8x DDR5 RDIMMs (6,400MHz) or MCR DIMMs (8,000MHz)

Storage

10-drive configuration:

10× 2.5-inch SAS/SATA/NVMe drives (hot-swap)

4-drive configuration:

① 4× 3.5-inch SAS/SATA/NVMe drives (hot-swap)

② 4× E3.S SSDs (7.5mm) (x4, hot-swap)

12-drive configuration:

12× 2.5-inch SAS/SATA/NVMe drives (hot-swap)

PCIe Expansion

Front:

2× HHHL PCIe 5.0 x8 slots for SAS/RAID card expansion

Internal:

① 1× HHHL PCIe 5.0 x8 slot for SAS/RAID card expansion

② 2× SATA/PCIe M.2 SSDs

Rear configuration 1:

① 1× FH PCIe 5.0 slot

② 2× HHHL PCIe 5.0 slots

③ 1× PCIe 5.0 x8/x16 OCP 3.0 NIC

Rear configuration 2:

② 2× FH PCIe 5.0 slots

② 1× PCIe 5.0 x8/x16 OCP 3.0 NIC

Power Supply

Two 1+1 redundant hot-swap Platinum/Titanium PSUs with an output power of 800W/1,300W/1,600W/2,000W

Operating   Temperature

Air cooling: 5°C to 40°C

Liquid cooling: 5°C to 45°C (Refer to the White Paper for details)


Relevant Information

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KR1180V3
KR1180V3