Supporting up to 6 I/O extensions for flexible satisfaction of high I/O expansion scenarios, including all-flash and GPU resource pools.
Featuring superior cooling design, accommodating CPUs with the highest TDP within a 1U space.
Modular design in a flexible layout, significantly optimizing chassis depth for various application scenarios.
Separated boards for independent development, flexible matching, and replacement, enhancing architecture flexibility and ensuring maintenance ease for customers.
System compatibility with a range of rich and non-rich I/O SKUs, eliminating the need to replace the motherboard.
The single-socket architecture eliminating mutual socket access, UPI interconnection, and cross-NUMA access, resulting in reduced latency, which enhancing user experience, increasing system efficiency, improving interactivity, decreasing package loss rate, and supporting a higher number of concurrent users.
Maintenance | Cooling | |
Rear I/O | Air cooling | |
KR1180-X3-C0-R0-00 | Rear I/O | Cold-plated liquid cooling |
Processor | 1 Intel® Xeon® 6 processor (SRF-AP/GNR-AP), up to 350W TDP | |
Memory | Up to 8x DDR5 RDIMMs (6,400MHz) or MCR DIMMs (8,000MHz) | |
Storage | 10-drive configuration: 10× 2.5-inch SAS/SATA/NVMe drives (hot-swap) 4-drive configuration: ① 4× 3.5-inch SAS/SATA/NVMe drives (hot-swap) ② 4× E3.S SSDs (7.5mm) (x4, hot-swap) 12-drive configuration: 12× 2.5-inch SAS/SATA/NVMe drives (hot-swap) | |
PCIe Expansion | Front: 2× HHHL PCIe 5.0 x8 slots for SAS/RAID card expansion Internal: ① 1× HHHL PCIe 5.0 x8 slot for SAS/RAID card expansion ② 2× SATA/PCIe M.2 SSDs Rear configuration 1: ① 1× FH PCIe 5.0 slot ② 2× HHHL PCIe 5.0 slots ③ 1× PCIe 5.0 x8/x16 OCP 3.0 NIC Rear configuration 2: ② 2× FH PCIe 5.0 slots ② 1× PCIe 5.0 x8/x16 OCP 3.0 NIC | |
Power Supply | Two 1+1 redundant hot-swap Platinum/Titanium PSUs with an output power of 800W/1,300W/1,600W/2,000W | |
Operating Temperature | Air cooling: 5°C to 40°C Liquid cooling: 5°C to 45°C (Refer to the White Paper for details) |
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