The KR2190V3, KAYTUS's new-generation 2U single-socket/dual single-socket general-purpose server, pioneers the commercialization of Open Compute Modules (OCMs) and leads the industry. Featuring the Intel® Xeon® 6 processor or 5th Gen AMD EPYC™ 9005 series processor, it supports full decoupling along with on-demand replacement and asynchronous upgrade of compute/management/storage modules. Ideal for container cloud and big data applications, it delivers robust computing power while limiting the data blast radius to enhance system stability for users.
Modular design for flexible single-socket/dual single-socket configurations to meet varying user needs.
Enabling chassis decoupling for adaptable I/O expansion, catering to computing, storage, and GPU application demands.
Minimizing data blast radius with single-socket/dual single-socket system design; narrowing the impact range during failures; reducing data migration time; improving system reliability by lessening failure impact; boosting fault tolerance; curbing security vulnerability impact for secure management and repair.
The single-socket architecture eliminating mutual socket access, UPI interconnection, and cross-NUMA access, resulting in reduced latency, which enhancing user experience, increasing system efficiency, improving interactivity, decreasing package loss rate, and supporting a higher number of concurrent users.
Offering straightforward cable routing: preserving signal integrity and ensuring accurate, swift data transmission.
Incorporating proper cooling airflow design: boosting cooling efficiency and lessening cooling challenges, as well as mitigating the adverse effects of parasitic capacitance and inductance to optimize the motherboard's electrical performance.
Employing a reasonable layout: diminishing noise interference from PSUs on other components and reducing signal transmission latency, thereby improving the motherboard's overall performance.
Maintenance | Cooling | |
KR2190-X3-A0-R0-00 | Rear I/O | Air cooling |
Form Factor | Supports up to 2 half-width single-socket computing nodes, with optional single-socket or dual single-socket systems | |
Processor | 1 or 2 Intel® Xeon® 6 processors (SRF-AP/GNR-AP), up to 500W TDP | |
Memory | Up to 12x DDR5 RDIMMs (6,400MHz) or MCR DIMMs (8,800MHz) | |
Storage | 12-drive configuration: ① 12× 3.5-inch SAS/SATA/NVMe drives (hot-swap and compatible with 2.5-inch drives) ② 12× E3.S SSDs (16.8mm)/E1.S SSD (15mm) (x4, x8, or x16) 24-drive configuration: ① 24× 2.5-inch SAS/SATA/NVMe drive (hot-swap) ② 32 × E1.S SSDs (15mm)/16 × E3.S SSDs (16.8mm) (x4, hot-swap) | |
PCIe Expansion | Rear configuration 1: ① 6× FH3/4L PCIe 5.0 slots or 4× 3.5-inch SAS/SATA drives (hot-swap) ② 4× HHHL PCIe 5.0 slots or 4× 2.5-inch SAS/SATA/NVMe drives (hot-swap) ③ 1× PCIe 5.0 OCP NICs Rear configuration 2: ① 6× FH3/4L PCIe 5.0 slots or 4 × 3.5-inch SAS/SATA drives (hot-swap) ② 2× FH3/4L PCIe 5.0 slots ③ 1× PCIe 5.0 OCP NIC Rear configuration 3: 4× FH3/4L 450W DW GPU + 1× 300W DW Smart NIC + 1x FH3/4L PCIe 5.0 card | |
Power Supply | Two 1+1 redundant hot-swap Platinum/Titanium PSUs with an output power of 1,600W/2,000W/2,700W/3,200W | |
Operating Temperature | 5°C to 35°C (Refer to the White Paper for details) | |