The KR2280V3, a high-end 2U2S rack server series, harnesses the power of Intel® Xeon® 6 or 5th Gen AMD EPYC™ 9005 series processors. This series embodies an ultimate design in computing and storage performance, scalability, and supports a range of deployment options including front I/O and liquid cooling. It integrates advanced technologies such as CXL 2.0, delivering computing power with differentiated optimal efficiency ratios tailored for various application scenarios. Its versatility ensures comprehensive coverage of common deployment needs.
Offering intelligent O&M with innovative features including early warning of memory faults through MUPR, seamless firmware updates with IRUT, fault diagnosis via DMPU, and load status LEDs, simplifying management and O&M processes.
Supporting InBry BMC, developed from the OpenBMC Project community, facilitates automated, refined, and secure O&M management.
Delivering top-tier computing, storage, and networking performance with a modular design for flexible configurations. Fully upgraded to PCIe 5.0. Supporting up to 45 2.5-inch drives or 22 3.5-inch drives, supporting 48 E3.S SSDs, and offering optional rear SATA/NVMe M.2 SSD modules to meet diverse storage needs.
Compatible with Intel Scalable Processor (SP) and Advanced Processor (AP) platforms, supporting 16 MCR DIMMs at 8,800MT/s. Expandable to 24 DDR4/DDR5 DIMMs with CXL AIC, delivering 30% greater memory bandwidth than RDIMMs to satisfy demanding memory performance needs.
Model | Maintenance | Cooling |
Rear I/O | Air cooling | |
KR2280-X3-A0-F0-00 | Front I/O | Air cooling |
KR2280-X3-C0-R0-00 | Rear I/O | Cold-plated liquid cooling |
KR2280-X3-A0-R0-H0 (AP Platform) | Rear I/O | Air cooling |
Processor | 1 or 2 Intel® Xeon® 6 processors | |
Memory | SP Platform: 32x DDR5-5600/6400 DIMM slots, accommodating up to 16x MCR DIMMs at 8,000MT/s (GNR). AP Platform: 24x DDR5-5600/6400 DIMM slots, supporting up to 12x MCR DIMMs at 8,800MT/s (GNR). Expands to 24x additional DDR4/DDR5 DIMMs with the CXL AIC module 8x CXL 2.0 E3.S SSDs in SRF / 12 CXL 2.0 E3.S SSDs in GNR | |
Storage | Front: 12x 3.5-inch SAS/SATA/NVMe drives | 24x 2.5-inch SAS/SATA/NVMe drives | 25x 2.5-inch SAS/SATA drives (with support for 4x NVMe drives) | 24 (1/2TB)x / 48 (1TB)x E3.S SSDs | 9x 3.5-inch SAS/SATA/NVMe drives | 8/16x 2.5-inch SAS/SATA/NVMe drives in front I/O configuration Internal: 1× TF card and 2× SATA M.2 SSDs | 2× NVMe M.2 SSDs 6× 3.5-inch SAS/SATA drives | 10 × 2.5-inch SAS/SATA drives | 8× E3.S SSDs Rear: 4× 3.5-inch SAS/SATA drives and 4× 2.5-inch SAS/SATA/NVMe drives | 4× 3.5-inch SAS/SATA drives and 2× SATA M.2/NVMe M.2 SSDs (hot-swap) | 4× 3.5-inch SAS/SATA drives and 8× E1.S SSDs | 10× 2.5-inch SAS/SATA/NVMe drives | |
PCIe Expansion | Rear I/O: up to 15x PCIe 5.0 slots, including 2x slots for hot-swap OCP 3.0 NICs Front I/O: up to 21x PCIe 5.0 slots (Front: 6x PCIe expansion cards and 1 OCP 3.0 NIC; Rear: 12x PCIe expansion cards and 2x OCP 3.0 NICs) Liquid cooling: up to 11x PCIe 5.0 slots, including 2x slots for hot-swap OCP 3.0 NICs, with 4x dual-width GPUs supported | |
Power Supply | 1+1 redundant Titanium/Platinum CRPS PSUs with an output power of 800W/1,300W/1,600W/2,000W/2,700W/3,200W | |
Operating Temperature | 5°C to 50°C (Refer to the White Paper for details) | |
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