The K24V3, a new-generation high-density multi-node server, supports both Intel and AMD platforms. Featuring compatibility with 3 types of single-socket/dual-socket compute nodes, it is tailored for high-performance computing optimization. The dual-socket configuration accommodates both air cooling and liquid cooling, with cold plates covering CPUs, DIMMs, and VR within a node. This approach achieves a high liquid cooling ratio, effectively reducing system power consumption and operating noise, and meeting the low PUE demand, assisting customers in building a new generation of green high-density data centers.
Precise leak detection solution for real-time leakage node location and automatic power cut-off, effectively reducing risks.
Liquid-cooled cabinets with detection and alarm functions for temperature, humidity, liquid leakage, and smoke, equipped with intelligent management platform for dynamic environment monitoring.
Highly reliable integrated cold plate design covering CPUs, DIMMs, and VR supporting 50°C (medium and high temperature) water inlet cooling, meeting the low PUE demand.
Efficient, energy-saving, green, and low-carbon liquid cooling greatly reducing fan speed, optimizing the O&M environment of the data center and maintaining a moderate noise level.
Quadrupling deployment density compared to traditional rack servers, efficiently accelerating server deployment.
Enhancing cabinet utilization amidst insufficient space in users' data center; supporting integrated cabinet delivery, greatly simplifying the deployment procedure.
Delivering industry-leading CPU computing power, accommodating 8 Intel® Xeon® 6 processors (Granite Rapids-AP) within a 2U space.
Featuring a disruptive system architecture design, enabling multi-host mode for high-bandwidth node interconnection.
Maintenance | Cooling | ||
Rear I/O | Air cooling | ||
K24-X3-C0-R0-00 | Rear I/O | Cold-plated liquid cooling | |
Form Factor | 2U rack chassis, including 4 independent hot-swap dual-socket computing nodes | ||
Storage | Configuration 1: 8× 2.5-inch SATA/NVMe SSDs (7mm) Configuration 2: 4× 2.5-inch SATA/NVMe SSDs (15mm) No-drive configuration (optional) | ||
Power Supply | 4x N+N redundant hot-swap 2,700W/3,200W Titanium PSUs | ||
System Cooling | 4x or 5x front 8086 system cooling fans with N+1 redundancy | ||
Operating Temperature | Air cooling: 5°C to 40°C Liquid cooling: 5°C to 45°C (Refer to the White Paper for details) | ||
Node Model | Maintenance | Cooling | |
KM1290-X3-A0-R0-00 | Rear I/O | Air cooling | |
KM1290-X3-C0-R0-00 | Rear I/O | Cold-plated liquid cooling | |
Form Factor | 1U half-width dual-socket compute node | ||
Processor | 2 Intel® Xeon® 6 processors (Granite Rapids-AP) per node, up to 500W TDP, with 6 UPI links | ||
Memory | Up to 24x DDR5 RDIMMs (6,400MHz) or MCR DIMMs (8,800MHz) per node | ||
PCIe Expansion | Air cooling: 2x PCIe 5.0 x8 slots | 1 PCIe 5.0 x16 slot per node Liquid cooling: 1 PCIe 5.0 x16 slot per node | ||
Multi-host Network | Supporting the multi-host mode, enabling uniform access and management of 2x nodes with 1 multi-host NIC | ||
Storage | Configuration 1: 2× 2.5-inch SATA/NVMe SSDs (7mm) per node Configuration 2: 1× 2.5-inch SATA/NVMe SSDs (15mm) per node 2× internal SATA/PCIe M.2 SSDs per node | ||
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